1.產(chǎn)品型號(hào) Model NO. | H4013W003A (-41+-3DB) | |||||||
2.電性能 Electrical Characteristics | ||||||||
序號(hào) NO. | 參數(shù) Parameter | 符號(hào)Symbol | 條件 Condition | 范圍 Limits | 單位 Unit | |||
|
|
|
| 最小值Min. | 標(biāo)準(zhǔn)值standard | 最大值Max. |
| |
1 | 尺寸Dimension |
|
| Φ4.0×1.3(H) | mm | |||
2 | 指向性Directivity |
|
| 全指向 Omni directional | ||||
3 | 測(cè)試基準(zhǔn)test condition |
|
| 2.0V 2.2KΩ | ||||
4 | 靈敏度Sensitivity | S | f=1KHZ, 0dB=1V/Pa | -44 | -41 | -38 | dB | |
5 | 操作電壓Operating Voltage |
|
| 1 |
| 10 | V | |
6 | 輸出阻抗Output Impedance | ZOUT | f= 1KHZ |
|
| 2.2 | KΩ | |
7 | 消耗電流 Current Consumption | IDDS | Vc=2.0V , RL=2.2KΩ |
|
| 500 | uA | |
8 | 信噪比Signal to Noise Ratio | S/N | f=1 KHZ , S.P.L=1Pa | 58 |
|
| dBA | |
9 | 減電壓特性 Decreasing Voltage | △S-VS | Vc=2.0V to 1.5V |
|
| -3 | dB | |
10 | 最大輸入聲壓Max Input Sound Level |
|
|
|
| 110 | dB | |
11 | 環(huán)保法規(guī)Environmental Regulations |
| RoHS | |||||
We use “Pascal (Pa)”indication of sensitivity as per the recommendation of I.E.C.(International Electro technicalCommission).The Sensitivity of “Pa” will increase 20dB comparing with “ubar” indication. | ||||||||
3.測(cè)試電路圖 Circuit Diagram 
4. 典型頻率響應(yīng)曲線 Typical Frequency Response Curve (far field)
5. 外形圖 Outside Drawing
6.可靠性試驗(yàn) Reliability Test | ||
經(jīng)過以下所有試驗(yàn)在溫度 15℃～35℃和濕度45%～75% 的條件下放置 3 小時(shí)后,要求麥克風(fēng)的靈敏度試驗(yàn)前后變化在 3dB 以內(nèi) | ||
6.1振動(dòng)試驗(yàn)Vibration Test | 1分鐘頻率變化從10Hz到55Hz，振幅1.52mm，在三個(gè)方向各振動(dòng)2小時(shí) | |
6.2跌落試驗(yàn)Drop Test | 分別把包裝的三個(gè)面從1米高處自由落到地面上，各10次 | |
6.3高溫試驗(yàn)Dry Heat Test | 在85℃±3℃環(huán)境中維持96小時(shí) | |
6.4低溫試驗(yàn)Dry Cold | 在-40℃±3℃環(huán)境中維持96小時(shí) | |
6.5高溫高濕試驗(yàn)Damp Heat Test | 在溫度45℃±3℃和相對(duì)濕度90﹪～95﹪的環(huán)境下維持96小時(shí) | |
6.6溫度循環(huán)試驗(yàn)Temperature Cycles Test | 按如圖溫度和時(shí)間循環(huán)10次 | |
6.7溫度沖擊試驗(yàn)Temperature Impact Test | 在-20℃±3℃環(huán)境中放置30分鐘，然后在70℃±3℃環(huán)境中放置30分鐘，這樣循環(huán)10次。 | |
7.儲(chǔ)存環(huán)境 Storage environment | ||
7.1貯存溫度/濕度 Storage Temperature/ Humidity ： | -40℃ ～ +85℃ / 35﹪～85﹪RH | |
7.2工作溫度/濕度 Operating Temperature/ Humidity ： | -40℃ ～ +85℃ / 35﹪～85﹪RH | |
8. 測(cè)量系統(tǒng) Measuring System
9. 回流焊條件Reflow Process Condition
| Parameter | Reference | Specification |
Average temperature gradient in preheating |
| 2.5°C/s |
Soak time | tsoak | 2-3 minutes |
Time above 217°C | t1 | Max 60s |
Time above 230°C | t2 | Max 50s |
Time above 250°C | t3 | Max 10s |
Peak temperature in reflow | Tpeak | 255°C (-0/+5°C) |
Temperature gradient in cooling |
| Max -5°C/s |
*After the initial reflow, the MIC shall be resumed to ambient temperature if more reflow required. *Do not perform it more than twice.
*After two SMT tests, the sensitivity of the MIC unit shall change less than ±2dB for initial value *The MIC should be exposed to room temperature for 3 hours and tested.
10. 包裝圖 Packing diagram
防靜電袋 |
| 1000PCS |
中盒 | 190x185x4.5 | 20000OCS |
大箱 | 315x220x130 | 400000PCS |
防靜電袋 |
| 1000PCS |
中盒 | 190x185x4.5 | 2000OCS |
大箱 | 230x230x250 | 10000PCS |
11．其他 Other
11.1 注意事項(xiàng) Matters needing attention
X光掃描 X-Ray Screen
Mic 不能進(jìn)行X光掃描，如果必須要用X光做BGA掃描，最大劑量需按照下面圖表，Mic 的靈敏度在掃描之前和
之后都需要進(jìn)行檢測(cè)，檢測(cè)值需記錄作為參考。
The MIC should not be subjected to x-ray screening if it is absolutely necessary bo do BGA screening
By x-ray.the maximum dose applied to the MIC untshould be restricted per Table 11-1 The sensitivity of
The MIC shall be measured before and afire.The values should be recorded for reference.
Table 11-1 X-Ray Parameter
Parameter | Level Value | Unit |
X-Ray Current 電流 | ﹤0.080 | mA |
Distance 距離 | ﹥0.30 | m |
Duration 時(shí)間 | ﹤30 | s |
11.2電離空氣凈化 Ionized air cleaning
不要直接把電離氣槍帶到麥克風(fēng)的聲音出口。
Do not bring the ionized air gun to microphone’s sound outlet directly.
建議的條件: 距離﹥8cm;時(shí)間﹤5 sec
Recommended condition (Distance＞8cm; Time＜5 sec.)
11.3 木板清洗限制 Board wash restrictions
在回火過程后不要清洗板子是很重要的。這會(huì)損壞麥克風(fēng)的。
It is very important not to wash the board after the reflow process. This could damage the MIC.
11.4 真空限制 Vacuum restrictions
非常重要的是不要在麥克風(fēng)的口洞上拉一個(gè)真空。這會(huì)損壞麥克風(fēng)的。
It is very important not to pull a vacuum over the port hole of the MIC. This could damage the MIC.
